Design of innovative chips for the first high-performance, low-power, multifunctional integrated circuit board for stratospheric balloons. The PERTE CHIP grant was announced in July 2023, with the aim of boosting 21st-century Spanish industry through joint research and relevant representatives from various sectors, including ASE Optics Europe.
This project, led by HISPAVISTA, involves the companies ASE Optics Europe, Fossa, Multiverse, and Masermic, in collaboration with various technology centers: Gradiant, Cidetec, Tekniker, Tecnalia, the University of Seville, and UNIR.
The objective of the CHIP-NESE project is to apply SWIR imaging technology to a miniaturized, multi-service integrated high-computing board using low-power, quantum-inspired algorithms. A proof of concept will be demonstrated, enabling stratospheric balloons to be fully operational and autonomous.
This project identifies multiple use cases for benchmark problems found in real-world environments, with benefits for all ecosystems and the industry as a whole.
